One Article Review
| Source |  Security Affairs |
|---|---|
| Identifiant | 1245880 |
| Date de publication | 2019-08-06 08:11:02 (vue: 2019-08-06 11:02:15) |
| Titre | QualPwn Bugs in Qualcomm chips could allow hacking Android Over the Air |
| Texte | Researchers discovered two serious flaws, QualPwn bugs, in Qualcomm’s Snapdragon SoC WLAN firmware that could be exploited to hack Android device over the air. Security experts at Tencent Blade, the security elite unit at Tencent, have discovered two severe vulnerabilities, QualPwn bugs, that could “allow attackers to compromise the Android Kernel over-the-air. “QualPwn is a […] |
| Envoyé | Oui |
| Condensat | “allow “qualpwn affairs air allow android appeared attackers blade bugs chips compromise could device discovered elite experts exploited firmware first flaws hack hacking have kernel over post qualcomm qualcomm’s qualpwn researchers security serious severe snapdragon soc tencent two unit vulnerabilities wlan |
| Tags | Hack |
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